PC/ABS CHIMEI PC‑365

PC/ABS CHIMEI PC‑365

PC/ABS CHIMEI PC‑365 is a general‑purpose alloy resin. It combines the advantages of polycarbonate (PC) and acrylonitrile‑butadiene‑styrene copolymer (ABS), achieving a good balance among strength, heat resistance and processing performance.

Main Applications

Automotive Industry: automotive interior parts.

Electrical‑Electronic: electronic product housings, mobile phone shells, computer housings and accessories.

General Molded Articles: high‑grade safety helmets.

Physical Properties

Property Category Test Item Test Standard Data Unit
Physical Properties Density / Specific Gravity ASTM D792 1.13 g/cm³
  Melt Flow Rate 260℃ / 3.8 kg, ASTM D1238 13 g/10 min
  Mold Shrinkage ASTM D955 0.40‑0.60 %
  Water Absorption (23℃, 24hr) ASTM D570 0.40 %
Mechanical Properties Tensile Strength (Yield, 23℃) ASTM D638 53.0 MPa
  Elongation at Break (23℃) ASTM D638 85 %
  Flexural Strength (23℃) ASTM D790 78.5 MPa
  Flexural Modulus (23℃) ASTM D790 2260 MPa
  Izod Notched Impact Strength (23℃, 3.18 mm) ASTM D256 540 J/m
  Rockwell Hardness (R‑Scale) ASTM D785 110
Thermal Properties Heat‑Distortion Temperature (1.8 MPa, unannealed) ASTM D648 106 °C
  Vicat Softening Temperature ASTM D1525 136 °C
  Linear Thermal Expansion Coefficient‑Flow Direction (40‑100℃) ASTM D696 6.0E‑5‑8.0E‑5 cm/cm/°C
Flame Retardancy UL 94 Rating (1.50 mm) UL 94 HB
  UL 94 Rating (3.00 mm) UL 94 HB

Processing Parameters

Process Parameter Unit Recommended Value / Range
Drying Treatment    
Drying Temperature °C 80‑100
Drying Time h 4
Recommended Moisture Content % < 0.04
Injection Molding Temperature    
Rear Barrel Temperature °C 200‑230
Middle Barrel Temperature °C 230‑270
Front Barrel Temperature °C 220‑260
Nozzle Temperature °C 220‑260
Melt Temperature °C 230‑300
Mold Temperature °C 50‑100
Injection Parameters    
Injection Pressure Depends on molded parts
Injection Speed As high as possible

Note: All information above is for reference only!

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